Micralyne Inc.

Alberta – Edmonton – Edmonton

Corporation

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Micralyne is one of the world€™s largest independent MEMS (Micro-Electro-Mechanical-Systems) foundries. As an industry leader, Micralyne offers unparalleled MEMS product development and commercial volume manufacturing. Thanks to a unique blend of highly responsive service from a knowledgeable team and a track record of manufacturing success, Micralyne offers its customers efficient development times and quality products.
Micralyne has developed core competencies in several specialized fields including microfabrication, etching, thin film deposition, microfluidics, and assembly - test.
MEMS technology is built on the premise of making industrial components smaller, faster and less expensive. Micralyne€™s micron-scale solutions (i.e. 1000 microns = 1 millimetre) are found in automotive sensors for control systems, optical switching technology in telecommunication networks, lab-on-a-chip devices for drug discovery, and commercial pre-press equipment for printing today€™s most popular magazines.
MEMS devices are used in many industries including communications, transportation, energy, and life sciences. Micralyne's headquarters and state-of-the-art manufacturing facility is located in Edmonton, Alberta, Canada.
Country of Ownership: Canada
Year Established: 1982
Exporting: Yes
Quality Certification: ISO 9001
Primary Industry (NAICS): 334410 - Semiconductor and Other Electronic Component Manufacturing
Primary Business Activity: Manufacturer / Processor / Producer
Total Sales ($CDN): $10,000,000 to $24,999,999
Export Sales ($CDN): $5,000,000 to $9,999,999
Number of Employees: 160

Services:
Mems, Thin films, Microfluidics

Technology:
Capabilities include: • 4", 6" silicon wafers/glass, other substrates of odd size
• Double sided lithography, thick resist
• Metal Deposition – variety of films/stacks
• PECVD – oxide/nitride/oxynitride/amorphous silicon
• RIE and DRIE processes (Bosch/Cryo)
• Furnaces for annealing/bonding
• Wet etching of metal films, glass substrates
• Silicon anisotropic etching
• Au/Sn electroplating up to 40 µm
• Glass – Glass fusion bonding
• Anodic Bonding
• Gold/Tin Eutectic Solder bond
Dicing
• Silicon, glass, quartz and alumina
• Up to 10" x 10" substrate capabilities
Wire Bonding
• Automated wire bonders
Characterization
• SEM with x-ray analysis
• Thin film stress measurement
• Line width measurement
• Optical profiler
• Surface profilers
• Film thickness measurement
• C-V plotter
• Adhesion measurement
• Electrical test
• Automated visual inspections

Sector:
Plant Information: Total Plant Size (Areas sq ft): 50,000
Distribution of Employees
60% Manufacturing
25% R - D
15% Business
Key / Major Clients: Kodak
JDS Uniphase
Applied Biosystems
MicroCHIPS
Dalsa Semiconductor

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Profile ID: LFCA-COD-O-35042

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